Optimal design of multi-element lead-free soft solder with computer 多元无铅软钎料的计算机优化设计
A method was established for determination of impurity lead and iron in soft solder alloy by ICP-AES. 通过酸度溶解试验、干扰实验等,建立了ICP-AES测定软钎料中杂质铅和铁的分析方法。
Study on Wettability of Soft Solder in Gyro-Housing Soldering 陀螺仪壳体钎焊软钎料润湿性研究
Determination of Impurity Lead and Iron in Soft Solder by ICP-AES ICP-AES测定软钎料中杂质铅和铁
The polyimide cover layer was tried touse in the flexible area protection process instead of soft printing ink solder mask. 以及尝试采用聚酰亚胺覆盖膜对挠性区域进行保护取代软性油墨制作阻焊进行保护的工艺方式。
Die bonding process using soft solder, the main problems is the die bonding holes. 粘片采用软焊料粘片工艺,所存在的主要问题是粘片空洞。